Staff Engineer, Failure Analysis Engineering

Job Description

Perform package and PCBA assembly test defect from production, qualification on semi-finished or finished products. Define FA flow for each FA case. Generate FA report and assist process engineer for root-causing of defect/s. SME on key FA equipment, maintain the FA tracking and FA equipment log sheet. Develop the FA process and FA capability for new product and new technologies.

Qualifications

• Bachelor Degree and/or Master in Electrical/ Electronic or Microelectronic Engineering with minimum 5 years in failure analysis
• Familiar with package and device analysis methodology
• Familiar with semiconductor and SMT assembly process and technology
• Familiar with memory product technology and structure
• Understand memory product test process and methodology
• Skillful in performing failure analysis with FA tools or methodology such as 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, hot spot analysis, cross-section and dye and Pull analysis
• Strong solder joint defect assessment skills.
• Good communication and presentation skills
• Good teamwork spirit
• Fluent in English speaking, reading and technical FA report writing
• Previous FA experience in SMT assembly environmentis preferred

Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

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